The Acc Silicones AS1803 is a high-performance, one-part neutral‑cure RTV silicone adhesive sealant engineered for worldwide industries seeking reliable thermal and electronic bonding solutions. Designed for seamless integration into international manufacturing, electronics, automation, and energy systems, AS1803 delivers fast cure times, excellent primerless adhesion, and dependable performance from –50 °C to +220 °C. Its solvent‑free formulation ensures safety and compliance across markets, while its robust properties make it ideal for demanding applications where thermal conductivity and durability are essential.

Why Buy the Acc Silicones Thermal Adhesive, 8 h Cure, 310 ml Cartridge?

With a thermal conductivity of 1.55 W/m·K and UL recognition (E334038), it ensures optimal heat dissipation and regulatory compliance. Its neutral-cure, non-corrosive formulation makes it safe for sensitive electronic components like copper, while also curing rapidly upon exposure to atmospheric humidity to form a resilient rubber seal, all without the need for primers.

Product Unique Features and Benefits

• 1.55 W/m·K ensures efficient heat transfer under thermal stress.
• Operates reliably from –50 °C to +220 °C, suitable for global applications.
• Cures quickly with atmospheric moisture and adheres without priming, saving time and simplifying use.
• Neutral cure prevents corrosion on copper and alloys, crucial for sensitive electronics.
• Compliance verified via UL file E334038, facilitating global certifications and trust.

Usage Information

• Heat sink bonding for microprocessors and power components
• Thermal coupling between electronic devices and chassis or enclosures
• Chip-scale packages and BGA heat-spreader interfaces
• Sensor encapsulation and thermal management in IoT devices
• Automotive and industrial automation that require durable, heat-resistant adhesives
• EV charging systems and power semiconductor assemblies